Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did
Electronics Forum | Fri Apr 16 17:20:34 EDT 2021 | astarotf
We are currently producing a project that brings a TQFP64. But some boards do not solder the component well with its ideal fillet, some are well soldered when they come out of the reflow oven, but some are not. Can the pins be sulphated? How can we c
Electronics Forum | Tue Jun 14 14:57:29 EDT 2022 | glasscake
Check for warp during reflow or placement, if your board is bowing you are not going to make a good solder connection. If your board is warping during reflow you may need to make a currier to support the board during reflow if using the edge to tran
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
Electronics Forum | Thu Jun 17 20:48:18 EDT 1999 | Earl Moon
| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Tue Mar 08 09:56:05 EST 2005 | caldon
Tim- You have two separate issues 1) Stencils and 2) wave. Stencils you can purchase a ultrasonic system that will remove the paste automatically or you can use stencil wipes to remove it manually. I would refrain from using towels and IPA as it dilu
Electronics Forum | Tue Jan 24 07:43:45 EST 2006 | Chunks
Q: If you do not use a selective wave pallet does this not leave the possibility of solder flowing up thru the Via's on the board? A: No. Your board house can cover your vias with solder resist. Your board house can plug the vias. You can cover t
Electronics Forum | Thu May 18 20:42:36 EDT 2006 | davef
Hypothesis #1: We agree with Steve. You are probably seeing the nickel underplate. The gold was absorbed into the solder in portions of a second, so that you don't see it is not surprising. We're guessing that the gold was porous and allowed the n
Electronics Forum | Tue Jan 30 09:26:59 EST 2007 | CK Flip
I think most people don't "get" soldering, and advocate the "more-is-better" approach as if solder were duct tape - you know...the more duct tape you put on something the stronger the bond. Such is NOT the case with soldering. People don't "get" that
