Electronics Forum | Wed Nov 09 07:46:58 EST 2005 | chunks
Hi Herb, Lexman, try a different paste to eliminate that question mark. Unless you're stuck with Kester, it's worth a couple hours of your time. I know of a couple SMT plants that run 40% to 50% humidity without any problems.
Electronics Forum | Sat Nov 11 07:54:53 EST 2006 | davef
Many use the following guideline when judging the proper paste for a stencil aperature: You want approximately 5 particles minimum across the smallest aperture.
Electronics Forum | Fri Aug 03 14:46:48 EDT 2007 | realchunks
Hi Roy, Depends onmany factors. Your plants environment, the ype of paste, the size of the syringe, your smallest aperture you want to release too, type of screen printer, etc... Your best bet is to perform a DOE and see for yourself.
Electronics Forum | Wed Oct 22 12:13:18 EDT 2008 | brismittr
A no-clean paste with an above average amount of halides should do the trick. Kester EP256HA is a good choice for this application if you are using a leaded alloy (Sn63 or Sn62).
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas
It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??
Electronics Forum | Wed Nov 09 10:25:09 EST 2005 | Amol
where in india are you laxman? and what kind of manufacturing are you involved in?
Electronics Forum | Wed Nov 22 02:37:20 EST 2006 | brodalvin
Thanks a lot for the responses...��
Electronics Forum | Tue Jan 23 17:21:30 EST 2007 | russ
Which characteristics? Russ
Electronics Forum | Sun Aug 05 20:26:18 EDT 2007 | coffee_12
Many thanks.
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