Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell
Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp
I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr
Electronics Forum | Tue Dec 03 18:51:57 EST 2019 | kylehunter
Hi all, We are having a confusing defect with one of our client's boards. It is a large board, 30" x 12". The client supplies the LEDs, they are cheap overseas diodes, and it is not uncommon to have reels with the packaging torn. We have w
Electronics Forum | Thu Jun 03 22:18:36 EDT 1999 | Dave F
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Thu Dec 22 12:05:37 EST 2005 | Tony
Currently we are using a 2 step vapor soldering process to manufacture our std. lead soldered parts. The first step was done with a ls240 vapor fluid and the second was done with a ls200 fluid. Using a 221 deg C sn95/Ag5 solder for the first step a
Electronics Forum | Mon Mar 26 06:10:54 EDT 2007 | RH
Dennis: Have you considered Asahi as a solder ball source? Asahi Technologies has helped produce over 90 million Lead Free PWB assemblies worldwide and has extensive experience in Lead Free solder processes at Sony, Hitachi, and Thompson. Solutions
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
