Electronics Forum | Tue Jan 23 07:18:24 EST 2007 | cyber_wolf
Hi, We have a UP2000 with grid lok installed on it. We run several assemblies that have component pads close the edge of the board. The side clamps hold the stencil up off the board and we are either getting insufficients or excessive solder paste in
Electronics Forum | Tue Jan 30 03:44:17 EST 2007 | frank63
Thank you for feedback and comment. We are trying this again, increasement of solder temp to reach 210-215 peak temp. This is also our norml guideline, but in the past the colleagues had observed problem with that PCB, so reduced it. I let you kno
Electronics Forum | Tue Jan 30 15:31:07 EST 2007 | slthomas
The must-do is to inspect for coverage and registration. How much bare pad and registration error you can tolerate is process and product dependant, but you can measure both fairly accurately with a reticle on a microscope. Developing measurement te
Electronics Forum | Mon Feb 12 01:19:27 EST 2007 | Wayne
the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning working (only press then work) and etc..... the simple way to solve this issue is to use low temperature solder paste, it can melt in between 220 to 225
Electronics Forum | Mon Feb 12 13:01:09 EST 2007 | campos
Hi all,, I running SMQ230 solder paste with a time above = 40sec with peak temperature = 239 degrees .. the complete reflow takes almost 6 min with a slope (150to190) close to .60 degrees/sec .. may I have some concern about that or it's ok?? tks..
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Thu Mar 01 14:54:45 EST 2007 | slthomas
By used to you mean scraped from stencils and bucketed? If that's the case I'd check with the guys that recycle my dross. That's who did ours when we had volumes that justified it. Now we have so little it goes into the hazmat hamper with everything
Electronics Forum | Sat Apr 21 16:16:15 EDT 2007 | GS
150 grams)on a very thik board (> 3,5 mm)( we did it by DRS-24). On top to this, in case of need you can use also hot N2 (Nitrogen)and get low ppm of O2, for instance when soldering on OSP finisching using NC paste, etc, if required. Regards...GS
Electronics Forum | Mon Apr 30 16:07:20 EDT 2007 | vlad_uk
Hey Basam, What sort of production do you have and what size boards, changeovers etc. The politics is irrelevant to the best machine for your production environment? Mydata's are not the only option and the Used market is full of good alternatives,
Electronics Forum | Wed May 02 06:28:26 EDT 2007 | LC
In our first run, we actually followed the solder paste recommended profile then we were told to use the BGA recommended one. When we had the 2nd run we still got the same problem. We're using Kester 909HPS (lead free) and ENIG boards. Thanks.