Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter
Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at
Electronics Forum | Tue Dec 15 09:26:37 EST 2020 | stivais
Have you tried cutting the leads shorter (or lift the connector slightly) so that they barely protrude at the other side of the PCB? Just for testing purpose, for mass production you should find a connector with shorter leads then. This should help w
Electronics Forum | Thu Jan 13 21:53:44 EST 2022 | mihai_voivod
Thank you for your response. I watched your video and I liked the solder ball rework method. However this is not related to the issue I'm experiencing or the way I intend to fix it.
Electronics Forum | Fri May 13 22:24:47 EDT 2022 | glasscake
Try adding blow after mount before head up if your machine lets you. Make sure your placing the part into the solder paste as that will add some holding force as well. If your tips are spring loaded you can do some 0.5mm additional mounting height.
Electronics Forum | Fri Nov 11 22:14:11 EST 2022 | kumarb
I would certainly test the boards but from our experience, the vacuum sealed in room temp, no issues at all with our PCBs sourced from Suntak / PCB Founder / Fastprint / Yaxinda / JLCPCB well past the 12 month mark. We building boards purchased 5-10
Electronics Forum | Wed Jan 11 06:07:11 EST 2023 | sarason
Also small quantities of solder paste can work its way into the shaft making pickup vacuum erratic also between the inner and outer shafts making travel up and down erratic which can cause bad placement. We always used to clean the nozzles in isoprop
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Thu Nov 30 10:05:02 EST 2023 | jineshjpr
All depends on how accuracy you require -- Incase if the PCB layers are same along with same solder paste uses -- pls segregate as batch in terms of similar pcb dimension ( within 30cm variation) attach thermo couples to maximum area -- May be you ne
Electronics Forum | Fri Dec 15 11:24:54 EST 2023 | dimamalin
Hello! I want to inquire about settings for MPM printers with the Camalot inside system. We will use Koki JU-R45 adhesive and Koki S3X58-M406-3 solder paste with a 21ga needle. If anyone has a similar system, could you please share the initial parame
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
