Electronics Forum: solder paste printing (Page 696 of 800)

Re: Tombstoning

Electronics Forum | Tue Dec 21 19:57:45 EST 1999 | Russ

All of the information so far has been great, I would like to add one more thing to the puzzle. We have utilized a "homeplate" aperture on the stencil when the pad geometry or PCB design prohibits all of the above mentioned remedies. The hompeplat

Re: Adhesive on hot PCBs

Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.

Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t

White Residue

Electronics Forum | Sat Dec 04 02:21:32 EST 1999 | Vinesh Gandhi

Hi All, I am facing a strange problem. One of my esteemed & valued customers has an unusual requirement of cleaning the board with IPA after soldering is complete. I am using alpha metals UP78 no clean sodler paste during reflow. This IPA cleanin

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 30 23:00:11 EST 1999 | Ricky L. Price

Bill S. is correct on the positive effects of the Smartsonic 440-R SMT detergent. We have been using this in conjunction with a Smartsonic 4200-2D ultrasonic washer that is equipped with a tank heater set at 100'F. Our suggested process window to p

Re: mixed technology

Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner

If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r

flow thru

Electronics Forum | Fri Oct 29 13:45:03 EDT 1999 | David Vulcano

We are placing several axial components that have STEEL leads. Have noticed that the steel components do not get good flow thru(we manufacture to IPC-A-610 Class II Standards which reqires 75% flow thru) We are using Seho Wave Machines with Nitroge

Re: Recycling Solder Paste?

Electronics Forum | Wed Oct 13 15:48:30 EDT 1999 | Jeff Sanchez

John, I'm sure your right! Cause my partner is laughing at me over the idea. "How often do we want HazMat at our door" "Do we really want to be friends with them on a first name bases" " Do we want to make friends with their friends,OSHA" I still thi

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam

| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Tue Aug 31 17:53:02 EDT 1999 | Dennis_F

| | | | | | Planning to evaluate the above process... | | | | | | Can anyone can give me some tips/infos on the above.... | | | | | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, i

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Wed Sep 01 13:51:38 EDT 1999 | Dave F

| Planning to evaluate the above process... | Can anyone can give me some tips/infos on the above.... | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different from a


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