Electronics Forum | Fri May 14 12:30:58 EDT 2010 | padawanlinuxero
Is there a way or process to use the screen printer to put solder paste in the thru holes ? The thing is that we are trying to put a thru hole in the same reflow oven with the other SMD components can some one explain how this work? thanks
Electronics Forum | Mon Jul 18 18:53:25 EDT 2011 | cecastel1510
I am working in the cost reduction department, we want to reduce cost on solder paste wasted, what are your reccomendations about it?
Electronics Forum | Wed Mar 21 07:44:19 EDT 2012 | cuervo
Hello ! I have a vitronics 500s ( five zones), and the solder paste is ALPHA OM-338-PT lead free. have anyone a profile to start and test, i need some reference temperatures.and conveyor speed thanks !!!
Electronics Forum | Fri Feb 23 14:51:48 EST 2024 | carl_p
Just another thought - how long is the printer idle for between boards? is it long enough to have the chemicals start to separate within the paste?
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Wed Oct 04 14:48:49 EDT 2006 | cw
My soak at 150C - 180C for approx. 85sec to 100sec. I believe this is sufficient. I can't change my paste because customer wants to use SnPb paste with SAC solder balls. They claimed that they have sucessful result with other CM. I need to know if
Electronics Forum | Fri Feb 23 11:29:02 EST 2024 | carl_p
Would you be able to post an image of the joint in concern? Sounds a good problem to resolve. Guessing you have used an external profiler & not the oven built in type? If 100% certain the profile is correct I would focus on the paste from my exper
Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj
Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp
Electronics Forum | Fri Feb 23 14:50:14 EST 2024 | carl_p
That link doesn't work for me. From the more you explain - it does sound like an issue I've had in the past on a few different builds. In the end we traced it to a fault with the paste (they were having mixing issues in the chemistry) but they as y
Electronics Forum | Wed Oct 04 13:58:38 EDT 2006 | cw
hi Dave.F and All, I need to reflow SCA solder balls on Sn/Pb paste, i get a pretty OK solder wetting and collapse apperance, however, i am seeing voids everywhere, some of them is greater than 25-30%, which has exceeded IPC standard. Please advise.
