Electronics Forum | Wed Sep 21 01:51:32 EDT 2005 | hly
Cognex board is bad. Waiting to get a replacement. Thanks for offering to help
Electronics Forum | Wed Sep 21 02:05:34 EDT 2005 | hly
Thank you for your reply.
Electronics Forum | Sat May 29 13:53:18 EDT 2010 | jandon
MY500 minimum dot diameter is 0.33 mm (0.013”) so you still need stencil for smaller dots. You are liable to couple of jet printing solder paste manufacturer and there where I live, only official Mydata distributor can sell those solder pastes. Also
Electronics Forum | Tue Feb 19 19:36:21 EST 2002 | davef
You weren�t clear but I assume the problem is not widely distributed and affects only a few parts on each board. Do this trick: * Cut a ~1� piece of fairly serious wire, like 18 or 12 AWG. * Strip the insulation. * Gear-up with gloves, glasses, and
Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
Electronics Forum | Mon Nov 01 16:22:47 EDT 2010 | jax
Who Cares... Mix Away! Although you should not mix different Solder Pastes' together in a container or on a stencil (Mostly due to the flux, although solder sphere size and shape could cause an issue), mixing solder brands or chemistries on a board
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Fri May 21 15:57:08 EDT 2021 | emeto
The thinner the stencil the bigger the variation in terms of percentage. Most probably it was experimentally established, rather than calculated.
