Electronics Forum: solder paste (Page 141 of 660)

Voids in every Lead-free BGA solder Joint

Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW

What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and

BGA solder bridge - Adding Pictures

Electronics Forum | Thu Mar 03 14:05:49 EST 2011 | davef

Certainly the bridge is ugly, but the voiding is nothing that you should be bragging about either. Pretty ugly work. BRIDGING: If all of your shorts appear in the vacinity of the heat sink, consider reducing the amount of paste that you apply there.

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Lead-free and Leaded solder in the same reflow

Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward

Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi

Re: Reflow oven for solder side components??

Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca

| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave

How long can solder sit on panel

Electronics Forum | Thu Aug 10 11:32:34 EDT 2017 | dleeper

You could always take a scrap board, paste it, and let it sit out over night. Reflow it and then you should have a nice visual aid, covered in solder balls and grainy, irregularly shaped solder mounds.

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

Lead Free parts in Lead solder

Electronics Forum | Wed Mar 16 09:12:57 EST 2005 | russ

This condition has been discussed on numerous occasions in this forum. Please do a search in the archives. Anyway, the manufacturing industry has been using lead free parts for at least ten years with lead paste. It is the other way around that is

Less solder with fine pitch qfp

Electronics Forum | Mon Sep 29 11:44:39 EDT 2008 | manishc

We r facing less soder problem with qfp,using 4 mil tencil and lead free paste,tried out different combinations of reflow profile,can anybody suggest?

BGA solder bridge - Adding Pictures

Electronics Forum | Mon Feb 28 07:36:56 EST 2011 | davef

Kim Here's an approach to posting pictures: * On your posting, clickon 'Edit' * Scrolldown past the 'Quote' 'Preview' 'Post' etc line * Clickon 'Attachments' * Enter your picture location * Select the choice that allows viewing the picture * Close ou


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