Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Wed Oct 12 13:49:17 EDT 2005 | russ
Most likely happening during the cooling phase. I also produce many of these joints with no reliability, DOA, or field failures to date (thousands upon thousands). Contact your paste supplier and they will give you the technical stuff on what you a
Electronics Forum | Wed Feb 01 07:32:05 EST 2006 | Chunks
Try an intermediate paste like Loctite/Henkle 218. It's design is to be used in a mixed lead/lead-free process.
Electronics Forum | Thu Sep 11 10:18:15 EDT 2008 | gregoryyork
Sorry all I know is that storing the paste Tip down the flux will run to the tip of the cartridge so will be runny initially then dry up as you use the cartridge. Unless the Rheopump mixes it before application
Electronics Forum | Mon Apr 05 21:46:12 EDT 2010 | isd_jwendell
I have been using this series with AIM SnPb no-clean paste without problems.
Electronics Forum | Mon Apr 11 00:05:54 EDT 2011 | vinitverma
PROCAM is intended to extract Centroid from the raw Gerber only. You just need to have 2 layers (paste or mask layer - to identify pads, and silk layer - for reference designators). Centroid is the output of PROCAM.
Electronics Forum | Fri Jan 27 17:36:40 EST 2017 | davef
Consider that printing may not be the only approach to getting paste on to your board. Would a dispenser work better?
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
