Electronics Forum | Fri Feb 11 08:51:45 EST 2000 | HMAL
Dear Masdi, Perhaps you should check again your screen print process. Small amounts of solder paste under stencil can cause your problems. This paste is from previous printed pcb. When printing next pcb this paste attachs to places that it doesn't
Electronics Forum | Thu Aug 28 11:13:53 EDT 2008 | janz
Have you tried to run the same process but with diffrent solder paste manufacturer.? This give you information whether paste is ok. Try also print paste on the bare board and run through reflow oven. Check 2-3 boards. Is it the same places where i
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve
Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.
Electronics Forum | Sun Apr 25 17:36:45 EDT 1999 | Mohammad Yunus
Hi, Im doing some experiments and studies on lead free solders ( any alloys).I would like to get some information on a few lead free solder paste manufacturers and if possible their web page adress and contacts. Thanx in anticipation yunus
Electronics Forum | Thu Feb 28 20:37:17 EST 2002 | davef
What kind of "auditor" is this? Who does this auditor work for HP or CR Technologies? Maybe the auditor can quote 'chapter & verse' of the IPC specifications that state: * Inspection of any type is required to assure solder print processing repeata
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Tue Dec 09 10:46:58 EST 2003 | Peter
Hi. Is there anyone with experience in soldering standard smd on a pvd (physical vapor deposited) titanium surface? Are there any rules to obey? Especially concering solder paste, surface treatment, reflow profile and oven etc. Thanks
Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza
This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.
Electronics Forum | Mon Oct 31 01:52:44 EST 2005 | milroyperera
Hi, I`m having some troubles with reflow soldering RQFP-208 pin IC with 0.5mm pitch. The profile is done according the solder paste supplier specs but still this RQFP is shifting in the reflow process. What could be the cause of this and what would
