Electronics Forum | Fri Oct 20 11:16:14 EDT 2023 | tommy_magyar
I agree, and also, assuming you have SPI (if the solder paste roll is measured by laser) the SPI should not fail a board for such amount of missing paste.
Electronics Forum | Wed May 24 11:35:15 EDT 2000 | Bill Ng
Could someone help to let me know when we are doing stencil printing of solder paste on board with OSP surface finish on the land, the stencil is resting on the solder mask or the land itself. If it is resting on the solder mask, then, the actual pas
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Thu Aug 28 11:15:05 EDT 2008 | omid_juve
I've been there. Soldering no lead parts in a > leaded world can be difficult. Sounds like you > are not wetting to your parts becasue you ar enot > getting hot enough. Here's the trick - you can > turn up your profile to look like a no-lead
Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef
No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Thu Jan 20 14:28:49 EST 2000 | Scott S. Snider
I ran this test back in '92 or '93 when Alpha was first pushing to change from Brookfield to Malcolm readings. The correlation between Malcolm readings to solder paste height is good. I could always look at the viscosity reading and know at least a d
Electronics Forum | Thu Jun 23 05:51:32 EDT 2005 | Paul
Hi Folks, just wondering if anyone else agrees that Rheometric pumps do not work and are more trouble than they're worth. They do not circulate the solder paste properly. The only solder paste that is processed on a FIFO basis is the materia
Electronics Forum | Wed Apr 26 06:50:02 EDT 2006 | clampron
Good Morning All, We have recently switched to Kester HM531 solder paste due to some extreme environmental conditions. It has worked well and allowed us to continue production where we would be down with our previous solder paste. We have seen a re
Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne
I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA
