Electronics Forum | Tue Jan 15 21:44:05 EST 2008 | davef
We believe that tip tinners reduce the life of the tip, also. Why do you use such a product? We like using solder paste to clean solder tips. Place expired solder paste in a covered container. Open container and dip the tip. It comes out clean and s
Electronics Forum | Sat Jun 10 07:27:24 EDT 2006 | davef
Chuckie: SM4007A Diode case is D0-214AC G. Eisner: On tombstoning: * Check reflow profile * Pads per IPC-SM-782 * Reduce amount of solder paste * Check component solderability * Place component accurately * Search the fine SMTnet Archives for backgr
Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais
The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different
Electronics Forum | Wed Sep 29 16:21:15 EDT 1999 | Mark Quealy
| | There is a company selling pcb with the solder past on the pads and coated with a tacky film to hold the part during assembly. Have you heard of them and can you tell me how to contact them? | | | | Contact Matt Kehoe at 770-475-4576 or 847-740
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens
| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Wed Aug 30 08:59:40 EDT 2006 | saaitk
Our facility in Asia wants to change their solder paste to a local manufacturer. I have recieved specs for this paste and compared to our existing paste spec, there is not really much difference in material composition. The Asia spec tests the paste
