Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Thu Dec 21 08:45:40 EST 2000 | Hussman
I've been asked to "heat up the oven profiles" to "burn off" the excessive flux so our vision equipment can inspect solder joints. 1. I am using Multicore SN 63 no clean solder paste. 2. We use CR Technology Vision Inspection. Before I get too
Electronics Forum | Thu May 25 11:51:12 EDT 2000 | AF Ng
Hi,Wolfgang Busko, Thank you for your help. Still need some advice. If the OSP board having stencil rest on the solder mask, then, would it has more gasketing effect( solder paste squeezed out to the underside of the stencil), as compared to the HAS
Electronics Forum | Fri Apr 07 16:04:34 EDT 2000 | John
Anyone out there using solder paste (dispense) on through hole technology parts? I would like to know how it's working out for you. Which method or technique are you using? Have you ever tried to dispense on the component side and place through the d
Electronics Forum | Tue Jul 24 08:22:16 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Tue Jul 24 08:22:56 EDT 2001 | markhoch
We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'
Electronics Forum | Fri Dec 24 04:22:11 EST 1999 | Keith Stone
When you get to fine pitch you might want to try reducing the aperture on the long dimension of the pad only. If you reduce the width of the pad you can get solder paste left in the stencil giving insufficient or unsoldered joints. Reducing the lengt
Electronics Forum | Thu Dec 09 15:14:41 EST 1999 | Ron Costa
I have been seeing wetting problems with Texas Instruments componets. I am using Kester 596L OA water soluble solder paste. My reflow profile is in spec. for this formula. Has anybody else seen this problem and if so how did you resolve it? Any feed
Electronics Forum | Fri Feb 12 14:06:28 EST 1999 | Craig Lowe
Bill, I would go with the second piece of advice by leaving a little film of solder paste on the screen. This is good advise if you are using a lookup/look down type of vision centering. Like on MPM and newer Fuji. On older Fuji GSP2/3 style printer