Electronics Forum: solder paste (Page 406 of 660)

Solder FINES vs. Solder Balls

Electronics Forum | Wed Apr 14 13:37:56 EDT 1999 | Mark Charlton

Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? I consider "fines" individual unmelted metal spheres that are found in solder

SMT PCA to chassis reflow

Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts

I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sat Apr 24 04:41:56 EDT 1999 | Murray Pulman

Dear C.K We are routinely wave soldering 0603 and sot23 on subcontract, hence we get what we are given!!. Being UK based we use a Blundell cms 400 dual wave soldering machine (made in Coventry), Tecan Stencils and Loctite 3612 adhesive. You must k

Soldering Temperature for TQFP160

Electronics Forum | Tue Jan 20 06:46:39 EST 1998 | IgmarG

This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Qu

Re: Soldering Temperature for TQFP160

Electronics Forum | Thu Jan 29 08:33:34 EST 1998 | Mike Moninger

| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi

Re: Soldering Temperature for TQFP160

Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott

| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c

Solderality problems with SN100C Lead Free Hasl

Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly

Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all

Soldering to Platinum/Silver terminations.

Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton

We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap

Solder Printing 2x2 inch ceramic Substrate

Electronics Forum | Thu Feb 15 16:58:11 EST 2007 | flipit

Phil, I used to print solder paste on 2" X 2" and 3" X 3" 96% Alumina substrates all the time. I used standard solder printers and stencils. Screens are difficult to use and don't print well. You can use a stencil on a DeHart, CW Price, or AMI Pr

Soldering problem with Au plating PCB

Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter

Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from


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