Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval
Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w
Electronics Forum | Sat Nov 04 07:46:36 EST 2006 | itwasbill
Hi all, What are the pro's and cons of pasting ahead? The definition of pasting ahead for this question is the act of pasting 10 or 15 pc boards and then running then repeat. I do not like this philosophy. I'd prefer to paste, run, reflow then
Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Wed Jan 04 17:06:20 EST 2006 | samir
All I can say about Alpha and their GOTT-DAMN website is THEY SUCK!! I refuse to register to view product literature... for that reason, Alpha Metals, you won't be looked at for my pb-free paste or bar solder evals.
Electronics Forum | Tue Dec 07 08:01:40 EST 2021 | jineshjpr
Hi DucHoang, Thanks for your response - Understanding that OSP will have more surface resistivity which does not allows the solder to flow on the entire pads. Let me check peak & revert back sooner.
Electronics Forum | Mon Dec 27 05:01:03 EST 2021 | jineshjpr
Hi JSeewald, You are very much right that there is difference between the solder pad with respect to IC pad. Since the Manufacturer suggests the same -- design also freezed to recommended dimensions.
Electronics Forum | Tue Dec 16 22:09:36 EST 2014 | deanm
The critical operations where cross contamination can occur is the paste printer, the touch up station and the hand soldering station. Hand insertion should not be a problem if the parts are kitted or issued with proper control. If possible I would
Electronics Forum | Wed Jun 21 13:25:16 EDT 2006 | muse95
I see what you're saying - I'm not a process guru by any means. I was going on the premise that SAC melts at a higher temperature than SnPb. Basically I think of it as a BGA is joining solder to solder, unlike an SOIC where it is tinned metal lead t
Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
