Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Thu Oct 13 17:41:28 EDT 2011 | dmiller
I guess I'll be different that the rest here. To stay consistent, I feel the best way is to use stencils to apply paste to the board first. We put paste on the board at SMT to solder them on initially. Then not when they get reworked? Why not tak
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Wed Sep 27 13:45:35 EDT 2000 | Bill Schreiber
Dear Dreamsniper, A big hidden cost in any cleaning system is the cost of diminished production and rework. I assume you are cleaning the adhesive stencils manually since there is no equipment cost in your formula. Manual cleaning of adhesive sten
Electronics Forum | Mon Jul 17 20:20:53 EDT 2000 | Dave F
There is a wide range of price points and configurations for such equipment. RFA (Read the Fine Archives) and contact the suppliers (supplier lists are in SMTnet and "SMT" & "Circuits Assembly" etc magazines) and get back to us with specific question
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Thu Oct 04 21:52:34 EDT 2001 | sjlevin
If you do not have one of the big in-line aqueous cleaners, then there is an easier way that is a lot less expensive. I suggest you try Asahi's AK-225T vapor degreasing solvent which has been around for 10 years now. And it is legal. If you have
Electronics Forum | Fri Apr 13 14:08:53 EDT 2001 | CAL
Proper setup and cleaning of stencil helps ensure repeatable printing performance. Cleaning processes need to be compatible with materials used in the manufacturing of stencils and solder paste. IPC 7525 should also help you out. We here would Inspe
