Electronics Forum | Thu Jul 21 12:04:01 EDT 2011 | ccouture
the appearance during the application was the same (to the eye). the feel to the touch is the same once it is dry and polished. The effect is the same when water is sprinkled on the treated surface. My understanding is that the product bonds to the s
Electronics Forum | Wed Feb 26 21:38:08 EST 2003 | jonfox
1. First and foremost is paste alignment. If you start out of the gates with a bad paste/pad relationship, it will be nothing but problems down the line. AOI is not required, but dial in the alignment, QC if necessary, then introduce the boards to
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Mon Mar 11 13:11:00 EST 2002 | steve_arneson
I have read all of the previous threads and have found it very hard to believe what I am hearing. The idea that AOI is not needed on your production line is like running a marathon without training before hand. You can only expect to get out of an
Electronics Forum | Thu Mar 18 12:32:16 EST 2004 | steve_arneson
There are many low cost paste inspection systems on the market today. It really depends upon your overall needs for process improvement. The CyberOptics LSM series of inspection devices use a single laser stripe to calculate both Height, Area and V
Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Mon Jul 23 20:18:18 EDT 2001 | davef
Prasad�s book, that an earlier poster mentioned, is good, but other books to consider are: * MacLeod Ross �Guide Design & Manufacturing V1 & V2� Electrochemical Publications * Wassink & Verguld �Manufacturing Techniques For Surface Mount Assembly� El
Electronics Forum | Tue May 18 03:17:50 EDT 1999 | Philip B
| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre
Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
Electronics Forum | Mon Sep 14 18:09:16 EDT 1998 | Dave F
| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste
