Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Wed Jul 15 03:20:51 EDT 2020 | wellmanrau
Dear Sir: We have the coating machine with good performance and price for market promotion. We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What produc
Electronics Forum | Tue May 31 09:40:23 EDT 2005 | mattkehoe
We have some boards that exhibit poor solder wetting when reflowed. Nothing fancy, smallest pitch size .050. See photo's at http://www.sipad.net/SnPbwetting.htm Is this ; Contamination on the HASL finish? Insufficient solder,not enough to cover pad
Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Wed Oct 20 20:25:10 EDT 2021 | stephendo
Why not do the other side first. And paste the pins from the connector side? Or maybe using solder preforms on the leads might work if you are afraid of the connector squishing the paste. I'm guessing the headers are raising because of the outgassing
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
