Electronics Forum | Thu Dec 01 17:24:37 EST 2005 | slthomas
Are you sure you're getting enough paste on the pads? It looks like you may not have enough flux to get the solder to wet properly.
Electronics Forum | Tue Jul 18 07:39:52 EDT 2006 | Chunks
Is the hole always in the same solder joint? What parts do you see the hole(s) on? Can you try a different paste?
Electronics Forum | Fri Jul 28 08:46:36 EDT 2006 | davef
Two lines of thought are: * That you have some solder connections points us towards components. It seems like the solderability protection on some components need to have the reflothermal recipe tailored for that component. * Paste selection is a BI
Electronics Forum | Tue Jan 30 04:20:26 EST 2007 | Phil J
Print your paste onto a ceramic tile, place the offending component onto it and send through the reflow oven; then observe the results. You will soon see if the component is solderable!
Electronics Forum | Fri Apr 13 03:20:57 EDT 2007 | bart.lozie@page.be
Hello, why focuss only on the printer and the paste, maybe the problem isn't there, maybe the problem is in the oven, is the component a havy one? because leadfree solder can't lift as mutch as a leadcontaining solder. regards Bart
Electronics Forum | Tue Dec 04 15:11:51 EST 2007 | realchunks
Frankly it's not a good process for large connectors. Messes up your screen printer and you get min acceptable solder joints, if that. Select solder is the way to go, especially with all the smaller units out there.
Electronics Forum | Thu Feb 14 12:44:48 EST 2008 | operator
Don't worry about the paste print. Just omit it from the stencil. Mask over all the SMT components after reflow with water washable WSOL masking. Then run it thru the wave to deposit the solder. Then wash to remove masking. Or you could manually run
Electronics Forum | Thu Jun 26 07:44:07 EDT 2008 | kmeline
Hello, we are having issues with two assemblies where the Melfs will lift or not solder on one end of the components. Has anyone had issues with this in the past? What can be done to help this? Thanks
Electronics Forum | Wed Aug 06 11:33:04 EDT 2008 | swag
We are having solder issues with this part. (See attached picture). Placement is good prior to reflow. All other parts are reflowing well and oven profile matches paste mfg. specs. well. This is non-ROHS, WS process. Any ideas on what might be h
Electronics Forum | Tue Aug 03 17:13:41 EDT 2010 | bradlanger
Craig, If it is LF Hasl it sounds like it applied too thin exposing the intermetallic layer wich is not solderable. We call out a minimum thickness of 80 microinches and have good results. We have had shops in the past that did not control the Hasl
