Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Tue Jul 20 14:17:34 EDT 1999 | Curtis
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Fri Sep 03 09:09:42 EDT 2004 | John
Does anyone know how to make a thermo profile on selective machine with one solder nozzle?The problem is that there are many points and lines with different break time and different speed. Thank you
Electronics Forum | Thu Mar 15 10:05:41 EDT 2007 | Johnny
Sorry new to this... Question: will I have any problem soldering a resistor network with SAC305 coated leads using a normal leaded wave process besides the normal board thickness issues Thx
Electronics Forum | Fri Apr 17 14:12:27 EDT 1998 | Earl Moon
| Is there anybody to help me ? | We have small balls appearing on the boards soldered by | wave soldering machine and it looks that use of nitrogen | is linked to the problem (because without nitrogen, we have no more | problems). | That remind you
Electronics Forum | Mon Jun 14 12:11:54 EDT 1999 | Earl Moon
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Fri Dec 16 04:41:30 EST 2005 | tk380514
A day and half is a life time for our solder paste, Almit V14L... but then we dont have in-line solder paste printers, we have micro BGA stencil that wont work with anything but new solder paste, 0.8mm pitch and pad size is 0.3mm, stencil thickness
Electronics Forum | Thu Jul 20 12:22:33 EDT 2000 | Jeanette
I am just starting to investigate the fesability of this process and have very limited knowledge. Is there any problems inserting components on the same side as the paste on a PTH. When a component is inserted in this way is there a problem with th
Electronics Forum | Wed Dec 01 07:47:57 EST 2004 | jdumont
I have been seeing this with a new BGA we have just started using from IBM. Is this a problem if the solder paste is wetted to the unreflowed BGA balls??? It passed our ESS testing with no problems.... TIA JD
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
