Electronics Forum: solder problem (Page 141 of 507)

White powdery residue following Wave

Electronics Forum | Fri Mar 02 16:47:39 EST 2001 | traviss

If the thinner you are using is 4662 and the correct amounts that should not be the problem. Is this the first solder operation? I would start by looking for rosen or no clean flux getting on the boards at some point before wave soldering and not bei

reliability of epoxy

Electronics Forum | Wed Aug 05 10:05:00 EDT 1998 | Paul Horan

I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the e

Solder Clogging

Electronics Forum | Fri Jun 04 16:30:10 EDT 2010 | jdm2008

I am running a cemelot 5000 and I am having trouble with the solder clogging up the needle. When the solder is removed it almost appears if it has reflowed. I am using a 22 guage needle, and the problem occurs with both type 3 and type 5 solder pas

RF BOARD + SOLDER PASTE TYPE PROBLEM

Electronics Forum | Mon Nov 05 15:38:29 EST 2007 | ck_the_flip

As unlikely that this may be, if the RF circuit is sensitive enough, and the minor change in alloy is the only thing that changed, this MAY be the cause. The circuit was probably tuned to Sn63/Pb37. The reason I'm not surprised? I once had a custo

Lead Free and ICT

Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry

Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng

QFN soldering

Electronics Forum | Fri Nov 09 10:37:38 EST 2007 | devajj

We have started using QFN packages in large volume and are having problems with no-solders. We are using 6mil stencil with 1x1 paste print to pad. These also have thermal pads with thru vias that we reduce the stencil aperture by 1/4. Board also ha

Problem with less soldering material on the pins

Electronics Forum | Thu Apr 20 02:27:11 EDT 2017 | pavel_murtishev

Mile, Please tell me more about your soldering process: - Are soldering process parameters the same for all three pins? - Is unsoldered pin connected to thermal heavy copper polygon? - What is your board surface finish? HASL? - Sn/Pb or LF process?

Re: Reflowing a thru-hole part

Electronics Forum | Wed Sep 08 22:48:27 EDT 1999 | armin

| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?

Building RF Power Transistors Test fixtures

Electronics Forum | Wed Nov 12 13:00:58 EST 2008 | cisridn

I have to build test fixtures for RF Power transistors. These components generate alot of heat so the PCB is soldered to a baseplate. The problem I am having is that I am getting too much solder flowing thru the via's and flooding the topside of th

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 09:53:40 EDT 1999 | lwk

| | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | Most common reason is uneven heating where


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