Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew
We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !
Electronics Forum | Tue Nov 12 13:11:40 EST 2002 | steve
Your heating temperature is too low. Check your process and run the board through again. Then the graininess problem should go away. Or, try some different solder.
Electronics Forum | Thu Jun 24 02:31:24 EDT 2004 | yukim
Currently we are having a lot of solder balls, after a few hours of continous production. This is how we work: load new solder paste at the beginning of the shift, less than 500grms. Then, the operator loads new solder paste periodically, every 3 to
Electronics Forum | Thu Apr 30 01:44:45 EDT 2009 | nibirta
sorry. i forgot to mention. we have now two cases! one with two different lots of solder paste and one with a bad lot of components. May be u are right. Somebody did something. By the solder ball test on glass no solder balls were found. Only in the
Electronics Forum | Sun Mar 13 23:30:59 EST 2005 | VS
After reflow AOI makes sense because it has the highest coverage of the defects. Problems like tombstone, lifted pins, open solder joints, some shorts and insufficient solder you will not find before oven. I would also not agree with the statement th
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Wed Feb 03 18:36:47 EST 1999 | Earl Moon
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Thu Aug 06 02:25:21 EDT 1998 | P.L. Sorenson - Technical Consultant
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Wed Feb 19 17:27:14 EST 2003 | ryanm
I have a problem with 0805 caps and resistors randomly falling off in the wave solder machine. Currently I am placing single dots of epoxy under 0805's. The single dot is flattened down so I know that the part was placed. In the past when we double
Electronics Forum | Tue May 09 18:30:35 EDT 2006 | muse95
I can understand the theory behind fewer tombstones with SAC. If people were having tombstone problems with SnPb eutectic solder, often switching to Sn62Pb36Ag2 would improve it, because with the addition of some silver, a small plastic zone in the
