Electronics Forum | Wed Feb 17 11:31:37 EST 1999 | Bill Schreiber
Dear Al, Are these reworked, double-sided boards? If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if this is a s
Electronics Forum | Mon Apr 19 11:21:25 EDT 2004 | Frank
WOW... Hi Dave and everybody. I'm very surprise that this thread is still alive. From all your comments and your good tips, I was able to confirm that my current profil is good. Concerning the small problem of soldering I still have, I've decided
Electronics Forum | Wed Mar 22 14:59:20 EDT 2017 | solderingpro
Hello Henry, I believe some further clarification may be needed for someone to assist. Is the component already soldered prior to reflow? Does the component have paste already applied going through reflow? (or as per my previous question, is it al
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Wed Sep 10 09:32:56 EDT 2003 | swagner
Dave F, so what kind of problems would I see if this turned into a problem?
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Thu Oct 27 08:27:57 EDT 2005 | Adam
Hi We are trying to solder a a contact whose base material is stainless steel, this is then nickel striked with a gold plating of upto 3 microns. We are trying to hand solder this to a standard 1.6 FR4 PCB with a HASL finish. We are seeing problems
Electronics Forum | Fri May 08 02:23:15 EDT 2009 | tang
Hi all, Presently, we have loan a thermometer probe from supplier which used to check Soldering pot temperature. But we found that the probe consisted of High CR6+ (Chromium) with reading about 187000ppm. As I know stanless steel consisted this ch
Electronics Forum | Wed Apr 13 10:05:58 EDT 2016 | donnie15
I am working on soldering an Large LGA module to a PCB and am having some issues with opens due to variation in the board flatness. I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. I have tried adding sol
Electronics Forum | Tue Jul 15 22:50:12 EDT 2003 | iman
We have an internal engineering study on blowhole solder joints and had helped reduce the problem to pinholes symtoms. The pinhole occurs in solder joint of a Land-Grid-Array (LGA) side-wall (external perimeter of package) fillets. Our customer is a
