Electronics Forum | Fri Jul 15 13:16:08 EDT 2005 | Brian
We have seen this problem in the past and had to deal with similar customer constraints. It's not the flux causing the wetting, but the placement and pad geometries as some have mentioned. To reduce or eliminate the problem, we have changed the ape
Electronics Forum | Mon Oct 31 09:52:23 EST 2005 | slthomas
The only problems I've ever had with 208's shifting out of alignment was with a board with too much HASL thickness. The lands had a convex profile and the parts kept slipping downslope. We put down a glue dot and ranted at our board supplier. Both
Electronics Forum | Fri Jan 19 13:31:14 EST 2007 | lit51
Is the failure just out of tolerance or is it non functioning? For tolerance problem, compare the x-rays of the good and bad units. It will take a very high resolution x-ray to spot the differences. Changes in capacitance values can occur based on
Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Mon Jul 16 08:42:14 EDT 2007 | realchunks
Hi Scott, Here is another thought. Check your wave solder machine visually. Does the wave flow on both sides of the nozzle? If not, you may have some dross build-up which may be causing your problem. Generally it will only happen on the very fir
Electronics Forum | Fri Jul 13 12:20:33 EDT 2007 | jdumont
There are a lot of areas that could be leading to this problem. We have some of these issues on some boards with this solder as well but the hole fill still meets IPC class 3 requirement of 75% vertical hole fill. Through hole diameter is important.
Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym
When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no
Electronics Forum | Wed Aug 29 02:21:42 EDT 2007 | jgrootkoerkamp
It is a lead free process with sac305. We use goldfinish FR4 boards. Preheat is between 110 and 115 degrees. I am sure it is a moisture problem because longer stored boards have more blowholes. What is the maxium period to store the boards without
