Electronics Forum | Mon Apr 25 17:46:04 EDT 2011 | ldavis
I think Patrick is on the right track. Try running the fixture 180deg out from typical, if possible, and see if the problem goes away or moves to another fuse clip. I've also noticed some wave fixtures can create air pockets that won't allow proper
Electronics Forum | Sat Aug 20 13:23:22 EDT 2011 | saju86ece
Hi, We are facing solder ball issue in Chip component of PCB. We had tried DEK parameter setting changes and also reflow setting but still now not yet solve this problem. board details are, 1.Class 2 prodct 2.HASL Finishing Plz advice me what actio
Electronics Forum | Fri Feb 01 05:18:59 EST 2013 | eniac
If you have a hard-gold on your pads, it's not a problem. Hard gold can give to you 4 or 5 times for PCB soldering (BGA repair). Soft gold (or flash-gold) can destruct, after that will start a migration of nickel up through gold, your pads will be
Electronics Forum | Sat Sep 16 15:50:48 EDT 2017 | ctran
An assembly with this improperly solder joints will have functional issues. We have encountered this many times with memory modules failures,RMA units. Reflow always solved the problem (in our many cases). Dwelling time may be the key to solve this.
Electronics Forum | Tue Feb 28 12:41:36 EST 2017 | deanm
Is anybody using Vicor VI Chips (SMT version)? We are using a number of these on some of our boards and are having inaccurate placement and insufficient solder issues (8 mil step stencil still not enough). If you are placing these devices: 1. Which
Electronics Forum | Sat Feb 16 20:13:45 EST 2019 | sarason
Your silver immersion layer is dissolving in the solder. I presume this is what is meant to happen. But with copper tracks underneath that should be fine. Does your SAC305 cover all of the pad. If so no problem. If not then you will need to flux your
Electronics Forum | Wed Nov 20 09:23:53 EST 2019 | alpha1
We had a board we fought with for a while with solder balls. Checked everything, Stencil thickness at .004, reduced apertures, changed paste 3 times, changed profile 3 times. Finally changed board vendors. Went from HASL to Emersion Gold. Problem sol
Electronics Forum | Thu Aug 20 07:11:25 EDT 2020 | sssamw
What your said looks like a acrylic coating thermal expansion causes small solder joint crack. Do you cure coating with heating, or heating after curing? Solder joint crack while you see resistor and QFN trouble? Clear and detail description of your
Electronics Forum | Tue Jun 14 14:57:29 EDT 2022 | glasscake
Check for warp during reflow or placement, if your board is bowing you are not going to make a good solder connection. If your board is warping during reflow you may need to make a currier to support the board during reflow if using the edge to tran
Electronics Forum | Thu Sep 06 17:37:05 EDT 2007 | hakerem
Hi Joris - There is an excellent wave solder guide called "Take No Prisoners" that includes instructions for attacking and eliminating solder balls and preventing their recurrence: 1. Increase Dwell Time Solder balls are normally caused by too much f
