Electronics Forum | Mon Jan 09 16:47:45 EST 2006 | slthomas
Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.
Electronics Forum | Tue Jan 17 09:30:35 EST 2006 | John S.
Anyone ever see problems with peel mask causing ionic contamintion/dendritic growth? Is there a preferred material for a no-clean soldering process? Thanks in advance, John S.
Electronics Forum | Fri Feb 03 13:15:44 EST 2006 | amol_kane
the flux in the solder paste should take care of the oxides. if possible print a board and run thru reflow to check for wetting issues......there are some published papers that say that the tarnish layer is too small to create any wetting issues or o
Electronics Forum | Thu Feb 23 09:30:45 EST 2006 | Rich
I would stay clear of this machine, had one and after a few years of use gave a lot of electrical problems, they are no longer supported by electrovert for electrical spares. Ours was a dual wave with HAK, 3 phase 380 volt.
Electronics Forum | Wed Mar 01 11:51:04 EST 2006 | ajaygarg1980
we are observing voids in solder ball bonding process using laser.Final metal finish is of Au on Cu.Can anyone tell me the reasons or solution for this problem.We are not using any flux at all.
Electronics Forum | Thu May 18 10:46:42 EDT 2006 | teilo
Why you have trouble just visit http://www.teiloengineering.com for stress free , lead free wave soldering production. We have already converted over 20 machines with no corrosion or contamination problems. All parts manufactured from titanium.
Electronics Forum | Thu May 18 10:50:43 EDT 2006 | teilo
No more corrosion or contamination problems. All parts manufactured from titanium. Please visit http://www.teiloengineering.com
Electronics Forum | Tue Jul 18 09:57:17 EDT 2006 | slthomas
You might try baking the boards before using them. If the problem goes away you might want to look at what sort of environmental controls your board fab guys are using/stuck with/wishing they had.
Electronics Forum | Tue Jul 25 03:10:05 EDT 2006 | reypal
If your Test tech able to analyze and tell you which exact ball/location is the problem, you may send it for cross section analysis and see how the solder connection behaves. also pls check your ESD implementation.
Electronics Forum | Wed Aug 30 09:24:55 EDT 2006 | cbudzinski
Has any one seen any problems with the Pace tips sence the tips went Lead Free, We are going through 2 to 3 times more tips sence they went to lead free tips.
