Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner
Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl
Electronics Forum | Fri Oct 02 11:59:37 EDT 1998 | jon Medernach
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Just a sugge
Electronics Forum | Sun Oct 04 08:07:53 EDT 1998 | jvo
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Check if you
Electronics Forum | Fri Apr 10 13:25:21 EDT 1998 | Jon Medernach
| Is there a good way to inspect BGA | balls ? Is there an inspection piece | of equiip.? The idea is to develope a process that eliminates insoection. BGA's, by the nature of the design, do not lend themselves to inspection. Even X ray is subjec
Electronics Forum | Fri Jan 30 16:07:45 EST 1998 | Srik Maganti
We are in process of building a product which is a double sided board ( SMT ) and PTH ( topside ). This particular product has a BGA on the topside of the board, which has a kind of plated top on the die. I have heard some companies have had a probl
Electronics Forum | Sat Jan 05 00:13:16 EST 2002 | Chris Veeneman
I have experienced the same problem with my Mark 3. I found the problem to be the solid state relays in the electrical control panel. Towards the front of the machine below the breaker rails. My oven's computer screen would show all was fine but my
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
Electronics Forum | Fri Dec 13 12:56:57 EST 2002 | kmcneeley
I've seen this type of problem before. You need to get on your bare board vendors. It's a process problem for them. When you add the heat in reflow or wave solder the vias open. I'd get the vendor involved and reject the bare boards. There is still a
Electronics Forum | Thu Jul 03 07:53:57 EDT 2003 | davef
That has to be the worst of all worlds. Someone goes out and buys the cheapest parts they can find, gives them to you [Loz], and wants you to assemble a perfect product. Well, it would be nice if you could console yourself by making Derick Jetter m
Electronics Forum | Mon Oct 20 11:48:34 EDT 2003 | blnorman
Who said there was NO evaluation? The paste we chose was evaluated based on a 20 point test score as well as material compatibility. Once we introduced it to manufacturing each line had problems. For one manufacturing treated it as a drop in repla
