Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Tue Aug 24 06:40:18 EDT 1999 | Gyver
| | | Hello everyone, | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. |
Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G
| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc
Electronics Forum | Fri Jan 29 07:55:52 EST 1999 | Wayne Bracy
| | | | | | Greetings, | | | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | | Also, is there any danger of the pcb's giving of
Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Mon Feb 28 03:46:34 EST 2000 | Hany
Hello 1-In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money to buy a UPS for a reflow oven. One
Electronics Forum | Wed Feb 23 11:02:41 EST 2000 | John
John, I'll try to take a crack at it. We manufacture our own boards, and have a high mix. We currently have BOTH a Camalot 2800 Dispenser and a DEK 260 Screen printer. We use the camalot for glue applications, and prototype paste. We use the printe
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Thu Jun 15 12:57:12 EDT 2000 | Dave F
0.0006" LT Total pad height = Thickness of ( Copper pad + OSP ) = 0.0014" + 0.00000157" = ~0.0014" (You must be using an organic solderability preservative (OSP) or Electroless Nickel immersion gold (ENIG) because 0.003" tin/lead or white tin would
