solder problem

"solder problem" search results in the Electronics Forums

4989 results found for "solder problem" in the Electronics Forums

Order by: Relevancy |   Date

MLF / QFN Lead Free Shorting

Apr 7, 2007 | Hi I dont think there is a stencil problem or a printing one but i think you should check you paste

LGA36 6.5 x 3.5 mm

Apr 6, 2007 | Mika: Based on what we hear you saying, we're not so sure we have a problem with the board layout [1

Lead free vitronics profile

Dec 15, 2006 | Hi, Hemendra Recently, We have carried out lead Free Soldering On our 4+1 Panasonic Reflow machin

PBGA open connection

Oct 3, 2006 | We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diag

Lead Free boards

Aug 29, 2006 | Dear Bruce, We had the same problem in the same condition. Every compnent and the PCB (OSP) ha

using gold on PCB pads

Jul 31, 2006 |

Where's the rush?

Feb 24, 2006 |

Mechanical strenght

Dec 8, 2005 |

Cracked Joints & Ultrasonic Welding

Nov 1, 2005 | Can't say too much about the solder joints issue, but about a decade ago we did have a lot of proble


Aug 25, 2005 |

SPC and Wave

Jul 14, 2005 | Sure you can use SPC charting on the wave setup parameters to warn of impending problems. Examples

0201 Machines

May 5, 2005 |

Soldermask Defined BGA Pads

Oct 15, 2004 | Matt, Had a similar problem with HASL that wasn't fluxed properly during fab. The appearance of

Wavesoldering Defect

Sep 20, 2004 |

Step stencil troubles

Sep 17, 2004 | Yes, i have used and experienced problems with step stencils, but these were mainly to do with the c

Pick Up Error

Aug 12, 2004 |

Wavesolder PCBs encounter pinholes

Jul 19, 2004 | Are you talking about small 'volcanos' that burst through PTH solder connections? If so, you have m


Feb 14, 2004 |

Selective BGA ball removal

Oct 29, 2003 | Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remov

Porosity in Good Plating

Jul 5, 2003 | If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to th

High frequency application board V.S rework CSP

May 30, 2003 | Hi all I am facing the problem with reoworking CSP component for high frequency application board

Aqueous Board Cleaning

May 20, 2003 |


Mar 18, 2003 |


Mar 11, 2003 |

Voiding in CSP Ground pad

Feb 7, 2003 | Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via h

Snapshot Process

Jan 31, 2003 |

Cleaning after repair.

Jan 23, 2003 |

BGA PCB Pad size

Jan 17, 2003 |

BGA void removal

Oct 19, 2002 |

BGA void removal

Sep 30, 2002 |

Cleaning SMD Adhesives

Jul 29, 2002 |

best reflow oven

On-board Dispensing of Dots & Lines