Electronics Forum | Wed Nov 04 16:56:27 EST 1998 | Chris Lampron
| | We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners sta
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Jul 24 02:32:35 EDT 1998 | Frank J. de Klein
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Thu May 28 22:49:32 EDT 1998 | D. Lange
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Thu Dec 06 11:01:19 EST 2001 | Carol Stirling
This SMT process certainly makes a body want to win the $$$ and retire! We have been trying to stabalize the process and keep running into new problems. Any help would be appreciated on this issue. All pads on both sides have the same look - partial
Electronics Forum | Fri Dec 07 13:15:45 EST 2001 | slthomas
We've experienced similar problems with film caps, specifically Panasonic's parts that are alledgedly compatible with both reflow and wave soldering. They are identified with either GB or JB p/n suffixes, which become either GX, GC, or JC for the ref
Electronics Forum | Mon Dec 24 01:43:34 EST 2001 | sanmatech
Recently started running flex board with tin lead connectors. The problem being that when we receive the parts incoming connectors are all bright and shiny. Now after going thru the heller we encountered cold solder. At this time peak temp was at 186
