Electronics Forum: solder problem (Page 416 of 507)

What is a typical SMT placement defect rate?

Electronics Forum | Sun Sep 21 15:48:48 EDT 2014 | gascon5383

Our company has a process standard that requires a double person check at the beginning of every run (size of run is irrelevent, whether 20 panels or 500 panels). Every changeover that occurs a first piece inspection is made before reflow. If all is

Aluminium capacitor rotation after soldering

Electronics Forum | Wed Apr 22 08:40:18 EDT 2015 | markhoch

Hi Myriam, I think we may need some more information. Is the Electrolytic (Aluminum) Capacitor placed more than once per board? If so, are all locations twisting? This would typically be caused by a thermal imbalance that could be design induced. (u

Immersion Silver - surface problems (need experienced help)

Electronics Forum | Mon Aug 24 17:58:10 EDT 2015 | warwolf

We have had some test results come back after we were getting poor wetting in our joints, we requested an EDS on our joints from our PCB supplier. They have provided the results and said that it was their fault and will replace. What I want to know

full nitrogen tunnel

Electronics Forum | Wed Jan 24 17:48:28 EST 2018 | ranap121212

Hello Could I ask for advice? We have new machines with a full nitrogen tunnel. Type of soldering nozzle: worthmann 5 rows and next nozzle (in this same machine) worthmann 7 rows. One person in my organization claims that the delta nozzle is not wor

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper

Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra

Electrovert Econopak Wave Solder Pot Temperature too much variability/Swing

Electronics Forum | Tue Jun 25 22:22:22 EDT 2019 | proy

We have an electrovert 16" econopak wave solder machine with two identical pots (exchange between Tin Lead and Lead Free). When the pots are exchanged the same thermocouple is used, and the same controller is used - with the set point adjusted. The S

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one

If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo

What method for cleaning a wiped board?

Electronics Forum | Wed May 03 13:34:04 EDT 2023 | proceng1

When we get a bad print at SMT, the operator uses the alcohol wipes and wipes the paste off the board. Then they use compressed air and another wipe. In most cases this is sufficient. Most vias are tented, but there still remains some solder sphere

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate

Re: *****Update: Depanelization Troubles; Please Read*********

Electronics Forum | Thu Jun 18 22:25:24 EDT 1998 | Dave F

| | | | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and


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