Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Wed Mar 10 10:11:10 EST 1999 | Justin Medernach
| | My printer evaluation has come down to the Fuji GP-6 or the Dek 265LT. I'm looking for experienced opinions on both of these options, we're currently running an older vintage Dek 265 printer that gives us constant electronic system problems. The
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
Electronics Forum | Wed Jun 30 22:00:29 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, b
Electronics Forum | Thu Jul 01 16:52:31 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a
Electronics Forum | Thu Jul 01 17:12:28 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with
Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F
John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (
Electronics Forum | Tue Aug 17 10:32:19 EDT 1999 | Boca
| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou
Electronics Forum | Tue Aug 17 10:35:52 EDT 1999 | Boca
| | | | | Ladies and Gentlemen, | | | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows
Electronics Forum | Tue Aug 17 10:48:16 EDT 1999 | Earl Moon
| | | | | | Ladies and Gentlemen, | | | | | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally f