Electronics Forum: solder problem (Page 471 of 507)

Re: labeling systems

Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary

Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis

Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

Re: white residue after wash

Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt

Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

The story so far!

Electronics Forum | Mon Dec 04 22:04:42 EST 2006 | KEN

1. Customers want simultainous manufacturing of PB and PB free assemblies but don't want to pay for separate toolng. 2. Customers wants PB free boards and doesn't understand lead parts can not go in the wave. Then gripe about missed shipping date

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon

| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following

Re: DPM-Rate for SMT pprocess

Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer

| | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medi

Re: Detecting lifted leads on QFPs

Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW

| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect

Re: Water Soluble Flux for Military

Electronics Forum | Tue Apr 14 15:42:45 EDT 1998 | Scott Cook

| Scott, | I am not really in a position to answer this as fully as I would like because most military work with which I am familiar is subject to some degree of secrecy most especially on the internet. At least we have signed up to such restrictions


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