Electronics Forum | Fri Feb 23 11:29:02 EST 2024 | carl_p
Would you be able to post an image of the joint in concern? Sounds a good problem to resolve. Guessing you have used an external profiler & not the oven built in type? If 100% certain the profile is correct I would focus on the paste from my exper
Electronics Forum | Tue Aug 22 11:17:04 EDT 2000 | Dr. Ning-Cheng Lee
The classic dilemma, cost vs. performance. In typical applications, Sn whisker growth is not an issue. It only seems to occur under extreme use (high stress, low temperature)conditions. Until this issue is fully addressed, Pd seems to be the favor
Electronics Forum | Wed Jul 06 12:04:39 EDT 2005 | sarag
Jason, If you have any pictures of this phenomena that might be helpful for the forum to see in helping diagnose your problem, you can send them to me and I can post them on my website to view. My email is sg_foresite@residues.com Sara Gorcos Fores
Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba
Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of
Electronics Forum | Tue May 23 15:01:24 EDT 2000 | A. Marques
Hello, I think the problem can be: 1.�- some humidity in the adhesive, 2.�- some bubble of air in the adhesive when you cured the adhesive some humidity will go evaporate and when you make the soldering the same soldering will make a bridge between t
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Mon Feb 27 06:42:37 EST 2006 | Slaine
What are the long term issues with high tin content solders on parts plated with silver over copper? Is it possible that the silver will be absorbed by the solder then over a long period of time the tin will react with the copper causing it to part
Electronics Forum | Wed Oct 10 02:04:10 EDT 2007 | omidjuve
hi we use a no clean solder paste with the sn63pb37 alloy and our high frquency board doesn`t have any problem in test but after this product is finished now we use 2 different solder pastes 1. sn62 pb36 Ag.4 RA tape 2. NC type lead free with Ag i
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Thu Jul 20 14:44:26 EDT 2000 | Bob Willis
If you are getting skips on these parts the most common reason for skips is gassing and wave too low. I would agree that wave soldering these parts is not ideal. If the shorts are always in the same location on one or two pins a glue dot done during
