Electronics Forum: solder shorts (Page 41 of 94)

MELF component short togehter

Electronics Forum | Thu Jun 13 11:25:40 EDT 2002 | davef

Help us understand your situation by telling us about: * Is this a terminal-to-terminal short on a single MELF? Or is this a terminal-to-terminal short between or than one MELF? * Clearance of 0.8mm is the distance between what features? * Size ME

Touch-up and inspection of visual defects

Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel

Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only

AOI side cameras

Electronics Forum | Fri Sep 07 17:38:23 EDT 2007 | bentigano

Hello James. I've got a YesTech YTV-2050 system at work with one top-down camera, and 1 side-view camera for each of the four sides. I do have the side view cameras being used for automated side inspection. There are some parts with markings that are

Rework Nihon Solder

Electronics Forum | Fri Oct 14 03:50:08 EDT 2005 | steve

Alot of folks are going to experience this with their poorly designed desoldering systems. I would check the temperature that is being delivered at the tip of the desolder gun. A small preheater is recommended. The other problem you will encounter is

Re: Help me increase my first pass yields

Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys

| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure

Re: Entek coating

Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter

| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m

BGA REFLOW PROBLEMS

Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire

I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub

Re: Wave Soldering 0.050 pitch connector

Electronics Forum | Sat Oct 28 10:13:27 EDT 2000 | KF Lok

1) Try to keep lead as short as possible. 2) The long side of the connector in the direction of conveyor. 3) Use pallet, design such that the connector is 45 degree to the wave.( or conveyor). May not remove all shorts but reduce to one area i.e. th

cleaning of no clean flux

Electronics Forum | Wed Aug 10 07:55:21 EDT 2005 | ajaydoshi

we are using heareous F381, F352 no clean solder paste. specially in qfp for high frequency board we observe that cleaing / removing of ' no clean flux 'is require. if we do not clean same most of time after all test & envioumental test it shows pin

Reflow soldering of 208-RQFP-0.5mm

Electronics Forum | Mon Oct 31 08:29:51 EST 2005 | chunks

Shifting? Please describe the "Shifting". I.E. is it centering, sliding to cause shorts..... Most 208s will self center. If it's causing shorts, first check your print to make sure it is on the pads. Next check placement. Another area to check


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