Electronics Forum | Tue Feb 07 16:45:32 EST 2006 | Mike
Can someone point out what sort of defects at the joint I can expect if solder is above liquidus for 3-4 minutes rather than the typical 1 - 1.5 minutes. Voids? Grainy joints? Poor wetting? Thanks
Electronics Forum | Tue Jan 20 06:19:12 EST 2009 | lkpdsund
I mean compressed air... But what is the difference between dull and shiny joints? Is it better electric conduct? Does the N2 obstruct voids i.e. ??? Thank you for your answers.
Electronics Forum | Fri Apr 03 14:42:08 EDT 2009 | rkevin
Looking for potential pastes to evaluate (success stories), and any and all paste evaluation procedures you may have used sucessfully to qualify a new product. Definition, slump, release, tack, voiding, reflow window, etc. Thanks for any and all h
Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon
We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.
Electronics Forum | Fri May 21 07:44:28 EDT 2010 | mun4o
hi, I have similar problem 2 year ago.BGA256 , hole in pad technology.I order PCB manifacturer to fill hole with solder mask.And now everything is ok. regards
Electronics Forum | Wed Jun 11 14:09:58 EDT 2014 | spitkis2
Is anyone running reflowing in a vacuum oven to achieve void free connections? If so, are there any issues you are experiencing with this process? What level / measurement of vacuum that you need to achieve for good results?
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
Electronics Forum | Fri Jul 28 06:16:20 EDT 2006 | pavel_murtishev
Good afternoon, We run mixed LF/SnPb process for most of out products. Most of chip passives have lead free termination and some of them tend towards blistering issue. SnPb solder wets component in very strange way. Wetting phenomena seems to be abn
Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F
| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the
Electronics Forum | Sun Apr 25 11:44:14 EDT 1999 | Earl Moon
| | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are usi
