Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
Electronics Forum | Tue Mar 02 13:00:12 EST 1999 | Bill Haynes
| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run
Electronics Forum | Mon Feb 22 14:30:55 EST 1999 | Steve Gregory
Hi Bill! Justin hit the nail on the head with his advice. One other thing I'd add too is that if your volume and such points to using cartridges, I found that sometimes operators can get a little wasteful. I worked for a memory company where we
Electronics Forum | Mon Dec 29 09:37:25 EST 1997 | Craig Wilmer
| Can anybody give me feed back on the pro and cons of | using Pace, OK, Hakko, Metcal, etc... Kris, Pace is going to be your best bet when it comes to productivity. I used to do rework and repair for Compaq and all of the PCA lines in their manufa
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Wed Nov 17 09:51:25 EST 2004 | AS
I'm looking for advise on setting up a prototype station for smt (we are currently outsourcing smt production, but have a need for rapid in house prototyping). The station must be able to handle only single sided boards with components no smaller th
Electronics Forum | Tue Dec 14 04:01:08 EST 2004 | paul_fisher
We have a problem with dendritic growth that is affecting a new board going into production. This is of concern because they were subjected to Damp Heat Cyclic Tests as part of the product validation testing during their development. Fails to date
Electronics Forum | Fri Jul 28 06:16:20 EDT 2006 | pavel_murtishev
Good afternoon, We run mixed LF/SnPb process for most of out products. Most of chip passives have lead free termination and some of them tend towards blistering issue. SnPb solder wets component in very strange way. Wetting phenomena seems to be abn
