Electronics Forum | Wed Sep 29 17:42:08 EDT 2010 | asksmt
TH Parts are hand loaded - some are wave soldered and some hand soldered. smt 1206 on top side can be reflowed as you suggested but it's addition of one more step of reflow cycle in process for production. and i think that's why they are reluctant
Electronics Forum | Wed Sep 28 03:58:05 EDT 2011 | Jacki
Hi All My company is doing PCB assembly.To save cost, we change our wave solder bath from SnAg to SAC 305. What is the pros and cons for using SAC 305 solder? And,will affect to our quailty? Thanks in advance.
Electronics Forum | Wed Nov 16 12:54:00 EST 2011 | Shean Dalton
Jacki, your original post was regards to wave solder bath. With solder bar, there is no flux and you do not need to look for WS Sn100C. Sn100C is only a metal alloy. Regards, Shean
Electronics Forum | Mon Jan 23 21:45:40 EST 2023 | stephendo
Have you looked at simple solder fountains? If it is just simple connectors that might be all you need. Or maybe a small wave solder machine?
Electronics Forum | Thu Jun 03 21:27:58 EDT 2004 | davef
We know of two "solder savers" 1 Kester Formula 5749 Solder Saver: We believe Kester Formula 5749 Solder Saver to be a new formulation of Kleenox. Kleenox works. It helps separate the solder entrapped in the dross. [One tiny warning, one chemical
Electronics Forum | Wed Nov 12 05:59:12 EST 2008 | lococost
Yes, it is possible, and yes you do need to watch out for preheat and soldertime. The displays will get the hottest after they leave the wave, when the heat creaps from the PCB to display. Check your datasheets and do some testing for maximum heat.
Electronics Forum | Mon Apr 25 17:46:04 EDT 2011 | ldavis
I think Patrick is on the right track. Try running the fixture 180deg out from typical, if possible, and see if the problem goes away or moves to another fuse clip. I've also noticed some wave fixtures can create air pockets that won't allow proper
Electronics Forum | Wed Sep 05 08:06:08 EDT 2007 | davef
The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the c
Electronics Forum | Sat Jul 25 01:15:54 EDT 1998 | Chiakl
| | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wav
Electronics Forum | Mon Jul 27 13:49:53 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
.gif)
