Electronics Forum | Wed Aug 25 03:44:44 EDT 1999 | Charles Stringer
Mine's a fuji MX2700 1800 x 1200 pixels. +ve Small easy to use (operators do their own build guides) 8mb Smartmedia and floppy adapter make it useable on almost any PC = 8 pictures on best resolution Fair macro facility (you can identify 0603 compon
Electronics Forum | Tue Aug 31 09:20:22 EDT 1999 | Jon Gruett
| | This is out of the normal scope of this site but� | | | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Compone
Electronics Forum | Fri Feb 15 06:59:07 EST 2013 | davef
Use a standard that everyone will recognize. If you say, "The solderability test was performed in accordance with ANSI/J-STD-002 'Solderabiility Tests for Component Leads, Terminations, Lugs, Terminals and Wires'” [ipc.org/TOC/J-STD-002C.pdf ], every
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Wed Dec 13 11:11:20 EST 2000 | CAL
CONFUSED???? The the "BIG-chip-in-the-middle" on my image is IC732. IC304 is the 52pin QFP to the right of the "BIG-chip-in-the-middle".If it worked when the "Thingy" was there and does not work when the "thingy" is not there good indications are you
Electronics Forum | Tue Jan 08 17:33:26 EST 2002 | davef
You didn�t identify the type of tape you use, but Kapton or similar tape is not an effective method for attaching thermocouples. Search the fine SMTnet Archives for alternatives and comparison of methods. Two methods for mechanically attaching ther
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Tue Jun 26 19:50:00 EDT 2001 | davef
49 hits on nitrogen, you probably used the one with the entry window => 13 or whatever hits on nitrogen. Here is my take on what you missed by using the other seach: Date: May 26, 2001 04:57 AM Author: Brian Sloth Bentzen Subject: Nitrogen Reflow
Electronics Forum | Fri Apr 23 12:26:27 EDT 1999 | Jeff Anweiler
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | "Mesh Size" is a term that is commonly use
