Electronics Forum | Mon Dec 16 16:35:55 EST 2002 | Jim Ferris
Randy, Steve & all, Can you guys point me in the right direction when it come to using selective wave soldering...I am trying to get in-depth information on the Pro's & Con's of having our supplier use this process for our PWA's. (I can see there ar
Electronics Forum | Fri Jan 24 16:46:21 EST 2003 | MA/NY DDave
Hi, Distance Engineering is always difficult. I am guessing that the old machine and process ran wonderfully / acceptable. If you still have the old machine, how about running an empty board through it and then the new machine. Without flux observ
Electronics Forum | Fri Jan 24 17:05:17 EST 2003 | Hoss67
DDave, I do not have the benefit of having the old machine here for comparison unfortunately. Comparing topside wetting to old sample boards run on the older machine show similar results. No solder balls. I have a thermal profiler and have run ma
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef
With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al
Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn
It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Wed Sep 08 17:49:19 EDT 2004 | gregoryyork
Knock off some balls and you may find it has a flat bottom to it were it has mechanically stuck to the solder resist usually seen under 60X magnification. Common with Liquid photoimageable resist (I know again) Best way to check resist cure is to pay
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Thu Sep 23 16:23:08 EDT 2004 | russ
Pb free pastes do not wet out like 63/37. Their are no claims from any manufacturers that I am aware of that say it will. Your "little solder balls" are likely caused from oxidization during reflow. What type paste are you using 3,4,5? What are t
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