Electronics Forum | Sun Jun 07 09:38:42 EDT 1998 | Bob Willis
If you mean solder beads at the side of chip components then download the FAQs and the process guide on solder beads which may be of interest. The documents are on my web site www.bobwillis.co.uk | We are getting solder balls after reflow of surface
Electronics Forum | Wed Nov 14 12:11:04 EST 2001 | eabbott
We are experiencing many solder balls after wavesolder. Two different board suppliers of the same board are involved. My initial reaction was that it was the process but in researching information in this forum I am beginning to wonder. How can on
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Thu Mar 28 17:54:57 EST 2002 | slthomas
I realize that this is sort of off-topic, but do you have scads of solder beads (mid-chip solder balls, whatever you like to call them) with that stencil design? If not, would you mind sharing which paste it is that you are using? Email if you like
Electronics Forum | Fri Apr 19 08:19:26 EDT 2002 | jnunns
If the solder balls are next to your discretes, you should consider a homeplate design on you stencil apertures. THe only other time we have seen soler balls is due to the raw card. If the vias are not plugged by the solder mask, solder and air can g
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Mon Dec 02 16:01:15 EST 2002 | russ
If you can, attach athermocouple to the locations where you are getting solder balls. A previous product I had showed the same thing and we found that we had inadequate preheat leaving the liquid flux to splatter when it hit the wave. It could aslo
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
