Electronics Forum | Tue Apr 03 12:35:08 EDT 2012 | deanm
We have the same machine running the same alloy and have not seen this problem, but we're not running it nearly as much as you do. Have you asked Pillarhouse what could be happening? Try sending photos to them. They have been helpful in the past.
Electronics Forum | Tue Apr 03 13:28:11 EDT 2012 | davef
Is this related to this specific machine or this product? * Is this machine having a tough time regulating pot temperature? * Is this product dragging-out solder from the pot when it is being run so quickly? * Is this board out-gassing to create thes
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
Electronics Forum | Thu Jan 31 15:31:00 EST 2013 | rjohnston58
Are the conditions (Bullets) under the IPC Acceptable and Defect sections "ANDs" or "ORs"? In other words, does every condition under a section must be meet to be Acceptable/Defect or meeting any one condition suffices?
Electronics Forum | Thu Apr 25 21:36:07 EDT 2013 | ultimatejoker
Hi, thanks for the pictures. May I know in the first picture what are those numbers (i.e. 280, 290, 300, 310, etc) represent?
Electronics Forum | Tue May 14 21:40:23 EDT 2013 | ultimatejoker
What is the different between SAC and LF Solder Alloys?I found out that LF38 is SAC105 and LF45 is SAC305. Is it because LF is some standard international name for particular country?
Electronics Forum | Mon May 27 16:17:30 EDT 2013 | nikyta
Hi Eric, you have the right reduction on the stencils apertures? Also, a very oxidized solder paste can -and will do- promote and increase both the tombstoning as well as the solder balls.
Electronics Forum | Mon Dec 22 22:05:42 EST 2014 | slouis2014
What could be the possible solution for shorted BGA but only appears on the component corners. The BGA is 18mm x 18mm in size.The component solder balls are within specs and the pad design for the BGA is with standard. How can I solve this problem
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Fri Jun 19 09:10:20 EDT 2015 | kenkay
What is the best way to clean a bad print on a board of no-clean paste? We have tried a few different ways but always seem to get left over solder balls
