Electronics Forum | Tue Apr 27 17:37:30 EDT 2004 | Ren�
We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder > balls. Even if the print is dead on we still seem > to be getting them. We never seemed to have this > problem with old paste unless the print was
Electronics Forum | Thu Nov 11 11:11:18 EST 2004 | clampron
D.B., You are justified in your concern over the last requirement. I have been imposed by a customer with the same hand solder/rework requirements. It seems the biggest concern is thermally shocking ceramic chips. You are much less likely to do this
Electronics Forum | Wed Nov 17 08:20:47 EST 2004 | Chunks
Pros are no need to clean after reflow. No need to buy a cleaner or worry about "wet" parts afterwards when you're trying to test your unit. Cons are that most leave a bit of a residue behind. It's harmless but may drive your bed-of-nails tester a
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue May 02 15:09:40 EDT 2006 | PWH
Just a few problems you might have to deal with: 1) Your bare boards must be clean and kept clean though-out the process. You could notice handling contamination that might otherwise have been removed in your wash. 2) You will see solder balls a
Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky
Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet
Electronics Forum | Wed Jan 30 15:47:13 EST 2008 | tonyamenson
Just my humble opinion. Every place I've worked at uses x-ray over optical inspection for BGAs. Companies that had both often let the optical inspector collect dust becuase you can only really inspect the perimeter solder balls. Not to mention you c
Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk
HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
