Electronics Forum | Mon Aug 27 22:48:21 EDT 2001 | dougk
Used an older model of the one you described. Have used Asymtech and Fuji's as well. The Camalot is accurate, reliable, and easy to program. The only things I disliked about it was that is was slower than the fuji's, and if the pressures weren't set
Electronics Forum | Sun Sep 30 00:54:06 EDT 2001 | chinaman
Has anybody heard about solder wires for rework with a V-notch in order to avoid solder balls which might be caused by shooting flux when getting hot. The notch is as deep to reach the core so that the flux can expand easily. I can imagine the effect
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Wed Nov 21 21:50:50 EST 2001 | Glenn Robertson
Tony, What you are seeing can occasionally be caused by gaps in the plating of the blind vias. If they are not "airtight" you can get moisture coming from the laminate that shows up as voids in the solder balls. You might check on the board sup
Electronics Forum | Tue Feb 05 09:19:27 EST 2002 | Carol Stirling
Would someone be able to direct me to information on residual BGA stress please? I've been told that mounting the BGA involves residual stress to the solder balls due to different expansion characteristics of the BGA versus the board at the moment of
Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo
You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde
Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Thu Mar 14 21:54:23 EST 2002 | alex_kirichenko
Try looking at your reflow profile. If he slope is too steep you may get solder balls. I've had the same problem, had to slow down the profile a bit. If you'd like, there was discution on wave soldering chart.. and Speedline one hase some points f
Electronics Forum | Tue Jun 04 15:58:06 EDT 2002 | Hussman69
Hmmm... I know the Vitronics oven had bigger motors on em', but I don't think they're blowing molten solder balls around. You did say you changed your profile and stencil designs, which helped, but didn't exactly state what ya did. I believe this
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
