Electronics Forum | Tue Aug 03 09:47:39 EDT 2004 | AJ
Hi All, I have a question for everyone regarding SSD - Solid Solder Deposit. I have read many good articles on this "new" process and was wondering why it has not caught on. It is better known in the US as SIPAD or Precision Pad Technology. Here is
Electronics Forum | Fri Aug 06 11:36:15 EDT 2004 | russ
I see how that works in your shop, I was thinking of when you have someone else do it for you and then both sides would have to be done at the same time and then double reflow isn't very viable with out glue. How do you flatten the solder after refl
Electronics Forum | Tue Aug 03 16:52:41 EDT 2004 | Dreamsniper
Hi, What contributes to the above? I've got some BGA solder joints with a crystal like flux attached to it like a mini solder ball but do not have a perfect round shape. I had my aqueous cleaner's DI water sent for analysis and everything looks okay
Electronics Forum | Tue Aug 10 06:45:54 EDT 2004 | Snehal Acharya
Hi to all, I'm facing a soldering problem with one of my series of Product, since we were using a two different kind of PCB 1.GE(Glass Epoxy)2.PP(paper phenoline) in later PCB if i will use the same profile of the GE then it will get backed more & i
Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant
Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th
Electronics Forum | Fri Aug 20 07:20:18 EDT 2004 | rlackey
Hi, We've got a 6622, been running since Jan & does a good job. You may want to consider the smart wave option as this will (allegedly)force solder up the holes to give you better joints for lead free. Spray fluxer works very well, limiting the am
Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ
We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.
Electronics Forum | Tue Aug 24 15:05:39 EDT 2004 | Dreamsniper
There is danger in doing this based on theory. Chances of the solder joints becoming cold or having poor wetting due to the fact that during the first run all the flux vehicles had evaporated and with the second run they're no longer present to help
Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Thu Aug 26 13:31:05 EDT 2004 | Dreamsniper
Hi, I always caught our touch-up operators cleaning touched up boards improperly. Either by just wiping with lint free clothe the solder joints of the components after touch up or by just going behind the aqeuous cleaner and scooping some water then
