Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Mon Jan 04 15:07:27 EST 1999 | Tracy Hille
I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicke
Electronics Forum | Thu Jun 27 21:28:42 EDT 2002 | davef
You're correct that the Ni/Pd termination seems to have something to do with you solder balling. It could be related to the interaction between your paste and the Pd. I assume these are really 'fines' rather than 'balls'. Things that come to mind a
Electronics Forum | Tue Jul 27 04:18:55 EDT 2004 | Nippy
Hello, Is it possible to put polystyrene caps through the wave solder process ? We have always hand soldered these as temperature sensitive parts but would rather include them with other PTH parts through the wave solder. Manufacturer was little h
Electronics Forum | Wed Sep 19 21:04:57 EDT 2007 | wailiang81
Hi,davef, thanks for your concern. The condition was the pasted printed off with around 0.8~0.9mm from the land pattern. This will easy observe at QFP area. At fiducial, the stencil seens aligned accurately. Once solder bridge happend, its easy to
Electronics Forum | Mon Dec 17 02:08:21 EST 2007 | mun4o
Hi, I have a lot of solder bridge in our wave soldering process.We use SACX0307 and Surf 11 flux.the SW mashine is Vitronics delta 6622.Itry to change flux and termoprofile but results is not god.Can you halp me - recommend me some flux or other adv
Electronics Forum | Fri Jun 19 07:12:17 EDT 2009 | waveroom
I should know the answer to this question but it's Friday and my brain hurts. When soldering you create fumes that are from the soldering flux.. These fumes should be extracted or diverted. Question is at what point does the leaded alloy become a vap
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
Electronics Forum | Wed Jan 12 16:11:26 EST 2005 | russ
I have seen the solder shoot out at least 4"-6" from both the leading and trailing edge when this happens. If the open pockets are real deep you may want to use a turbulent/chip wave for soldering, sometimes this leaves bridges however.
Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
