Electronics Forum | Mon Nov 11 18:16:54 EST 2002 | Victor salazar
Michelle, I am very interested in hearing your results. Do you have any pics of grainy solder? You may e-mail me direct with any info. I would appreciate it. Thankyou vsalazar@uasc.com
Electronics Forum | Tue Nov 12 13:11:40 EST 2002 | steve
Your heating temperature is too low. Check your process and run the board through again. Then the graininess problem should go away. Or, try some different solder.
Electronics Forum | Thu Nov 07 06:10:13 EST 2002 | stefwitt
I used once flux cream on a glass plate for a customer application, which should simulate almost the same cohesion than solder paste.
Electronics Forum | Fri Nov 08 14:58:59 EST 2002 | davef
On the board support issue: DEK and Ovation Products make board support things to get at the issue you describe. Ovation hosted an On-Board Forum on SMTnet a while ago.
Electronics Forum | Wed Nov 13 23:50:23 EST 2002 | iman
we changed our top/bottom clamping system in the Printer, to a side-edge clamping system. This removed the higher paste issue similar to your thread.
Electronics Forum | Sat Nov 23 11:34:52 EST 2002 | mark
There is some superb tooling offered by a company called Transiton Automation, http://www.board-lok.com. There are some different choices, full molded tooing ... a service,... and re-usable fine grid pin array tooling.
Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave
Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s
Electronics Forum | Tue Nov 19 09:50:58 EST 2002 | GSW
Hi, Need to know if anybody has good reliability data on Sn/Bi component termination and Sn/Pb solder paste ? thanks GSW
Electronics Forum | Wed Nov 20 09:23:58 EST 2002 | Adam
Is it possible to achieve a 100% top-side solder fillet where pin 1 on the device is attached to a ground plane ? we've optimised the wavesoldering and fluxing operations, but without much success on that pin, every other pin is fine. Any advice woul
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
