Electronics Forum | Mon Apr 21 14:04:24 EDT 2008 | arminski
Hi dave, sorry for my late reply...right now do not have info about the LPI and I'm not allowed to talk to our supplier without going through our sales people...sux! cheers!
Electronics Forum | Mon Apr 21 14:26:54 EDT 2008 | realchunks
Then how the hell do they expect you to set up your processes?
Electronics Forum | Fri Apr 25 14:32:08 EDT 2008 | blnorman
Find out what the Tg of the LPI is. Below - rigid, above - flexible.
Electronics Forum | Mon Apr 14 21:43:04 EDT 2008 | joseph_gonzales16
Your problem is process you need to eliminate and there are so many causes to considered. 1.your solder paste 2.your PCB pads 3.your component 4.your profile 5.your printer 6.your placement. you need to isolate all these one of this is your problem.
Electronics Forum | Tue Apr 15 13:08:58 EDT 2008 | abaumann
If the solder had formed an intermetallic then it couldn't have pulled off completely like it did, it's obvious that the boards have a problem with their finish.
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
Electronics Forum | Tue Apr 15 06:10:54 EDT 2008 | aj
Try a new batch of Components ? We had a similar problem a while back - it was down to the component. aj...
Electronics Forum | Fri Apr 18 14:44:56 EDT 2008 | jax
Saunders Technology... or ECD (makers of M.O.L.E.) has what is called a TEMPROBE that will work how you want... even in "wet" solder paste. Maybe others here can tell you if it works well or not, I use KIC. www.ECD.com/saunders/tp.htm
Electronics Forum | Wed Apr 23 03:19:30 EDT 2008 | jkhiew
Hi all, Can anyone advise me what is the recommended floor life for pcb assembly prior to wave soldering before drying/degassing ? Thks Joseph
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
