Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Fri Jul 30 18:34:51 EDT 2010 | ranas
hi, just want to seek info regarding LF supplier who can do flip chip LF with solder nuggets. our supplier from USA is going to be closed due to financial constraint.. Anybody who can recommend.. asia location is preferrable.. thanks, Ranas
Electronics Forum | Wed Aug 04 16:30:44 EDT 2010 | dldavis
We are using a Propyl Bromide vapor degreaser solvent. Has anyone heard of this solvent when used near an oven will decompose and cause major corrosion to metals such as in a Reflow oven or a wave solder pot?
Electronics Forum | Fri Aug 20 06:32:44 EDT 2010 | aj
Hi, I would recommend you trial an alternative supplier if you have the option. I did a lot of trials on the issue and dont have any problems. Contact me off line and I will share details aj...
Electronics Forum | Fri Aug 20 10:07:09 EDT 2010 | dan_ems
Hello, I have the same problem ..., please take a print screen with the profile to see how is made it. Thank !
Electronics Forum | Fri Aug 20 10:49:37 EDT 2010 | cobar
Article to assist with Stencil Design Guidelines http://shanelo.co.za/technical_paper_about_stencil.htm
Electronics Forum | Wed Aug 25 15:24:07 EDT 2010 | mikesewell
Whatever you would normally use to print that size part on the pcb should work. Same aspect ratio rules apply for release.
Electronics Forum | Thu Aug 26 03:58:32 EDT 2010 | jacki
Hi all Did anyone encounter that the thermal crack failure or any failure issue by using the Kemet Ceramic Cap, particularly 0.1uF,while wave soldering? Before using this part, I want to clarify whether it is suitable for our process or not. Thanks i
Electronics Forum | Fri Aug 27 12:28:34 EDT 2010 | patrickbruneel
Under certain circumstances, Toyota says, solder connections may develop a crack that creates unpredictable behavior in the circuit. Look here: http://www.thecarconnection.com/marty-blog/1048692_toyota-recalls-1-1-mi
Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70
Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause
